BIM concept · Tender JKR/IP/CJ/T/2026/31

Paroi–Senawang Link (FT242 & FT243)

Kerja Awalan Menaik Taraf Jalan Paroi – Senawang, dari Plaza Tol Senawang sehingga Persimpangan Lebuhraya LEKAS, Seremban, Negeri Sembilan. Prepared by DPI Konsult Sdn Bhd.

Conceptual, for illustration only. Not a design submission. The alignment and profile are DPIK's tender-stage concept; the cross-section, pier sizes and heights are indicative.

6.0 kmconcept mainline, CH 0+000 to 6+023

5.1 kmelevated viaduct, Abutment A to B

128piers, spans 30–130 m

2 × 2lanes, 3.5 m, dual carriageway

Views along the corridor

Aerial view of the Senawang corridor with the concept viaduct — The corridor from Plaza Tol Senawang to the LEKAS interchange

Tie-in at Plaza Tol Senawang onto the viaduct — Tie-in at Plaza Tol Senawang, Abutment A (CH 0+315)

Viaduct following FT242 over the existing junctions — Viaduct following FT242 above the existing signalised junctions

Driver's view on the viaduct deck — Driver's view, northbound, left lane

Viaduct and piers at mid-corridor — Mid-corridor, CH 2+300

Looking back along the viaduct from the LEKAS end — From the Paroi / LEKAS end, looking back along the viaduct

How this model was made

Alignment: DPIK's tender-stage horizontal and vertical alignment (MX), in the GDM2000 Negeri Sembilan & Melaka Cassini grid (EPSG:3378).
Open BIM: the same geometry is exported as an IFC 4.3 model (IfcAlignment, IfcBridge, IfcRoad), georeferenced, and validated against the IFC schema. It opens in any IFC 4.3 viewer.
Context: Google Photorealistic 3D Tiles, shown with Google's attribution.
In the design stage this becomes the LOD 300 federated model under the BIM Execution Plan and CDE, used for clash detection against utilities and existing structures.